Improved liquid cooling head, liquid cooling head assembly and liquid cooling radiator manufacturing method

1. This utility model relates to radiator domain technology, in particular to an improved liquid cooling head, liquid cooling head assembly and liquid cooling radiator.

Background technique:

2. At present, the radiator used to dissipate the internal parts of the computer is generally a liquid-cooled radiator. Liquid-cooled radiator refers to the use of liquid to forcefully circulate the heat of the radiator under the drive of a pump. Compared with air cooling, it has It is quiet, stable in cooling, and less dependent on the environment. The heat dissipation performance of a liquid-cooled radiator is directly proportional to the flow rate of the heat dissipation liquid (liquid or other liquid), and the flow rate of the refrigerant liquid is related to the power of the liquid pump of the refrigeration system. And the heat capacity of the liquid is large, which makes the liquid-cooled refrigeration system have a good heat load capacity.

3. Liquid cooling radiator usually consists of liquid cooling row, liquid cooling head and liquid pipe. The liquid pipe is connected between the liquid cooling row and the liquid cooling head. The liquid cooling head includes a shell, a pump installed inside the shell and a The liquid inlet and outlet on the surface of the shell; in actual application, there are still some shortcomings, such as: 1. The weight of the entire liquid cooling head is relatively large. When it is installed and applied to heating components, the required fastening pressure Large, laborious and time-consuming installation operations, and easy to shake after installation; 2. The entire liquid cooling head is large in size and needs to be installed corresponding to the heating components, which takes up a large space and is not conducive to the internal space design of computer products; 3. Usually one One liquid cooling head is provided for the liquid cooling row, and it is difficult to meet the arrangement requirements of multiple liquid cooling heads for one liquid cooling row.

4. Therefore, it is necessary to study a new technical solution to solve the above-mentioned problems.

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